This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the c

Design technology to address the new and vast problem of heterogeneous embedded systems design while remaining compatible with standard “More Moore” flows,

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served w

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi

This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance comput