Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
Author | : F. Roozeboom |
Publisher | : The Electrochemical Society |
Total Pages | : 377 |
Release | : 2011-04-25 |
ISBN-10 | : 9781566778633 |
ISBN-13 | : 1566778638 |
Rating | : 4/5 (33 Downloads) |
Book excerpt: This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.