During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the mos

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a

This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building