This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.

This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.

The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opt

Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it present