Related Books
Language: en
Pages: 312
Pages: 312
Type: BOOK - Published: 2007-04-24 - Publisher: Springer Science & Business Media
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces
Language: en
Pages: 0
Pages: 0
Type: BOOK - Published: 2008-11-01 - Publisher: Springer
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces
Language: en
Pages: 259
Pages: 259
Type: BOOK - Published: 2020-03-16 - Publisher: Springer Nature
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, an
Language: en
Pages: 295
Pages: 295
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel M
Language: en
Pages: 305
Pages: 305
Type: BOOK - Published: 2024-01-19 - Publisher: European Alliance for Innovation
We are delighted to provide the proceedings of the sixth International Conference on Applied Engineering (ICAE), 2023, which was conducted in Batam on November
