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Language: en
Pages: 280
Pages: 280
Type: BOOK - Published: 2010-11-08 - Publisher: Springer Science & Business Media
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural des
Language: en
Pages: 167
Pages: 167
Type: BOOK - Published: 2019-12-20 - Publisher: Springer Nature
This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the stat
Language: en
Pages: 492
Pages: 492
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
Pages: 392
Pages: 392
Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
Language: en
Pages: 337
Pages: 337
Type: BOOK - Published: 2021-09-30 - Publisher: Cambridge University Press
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interf